Dispenser & Bonder
DNC-6200LA
DNC-6200LA Fully Automatic Dispensing & Attach
본 장비는 Die Bonder와 비슷한 장비로 디앤씨의 기술이 집약된 디스펜서 기능들을 기반으로 Bonding기능이 포함된 장비입니다.
FPCB 또는 PCB 위에 용액을 토출 한 후 Micro Display 또는 Die를 정밀 Attach하는 장비입니다.
- Dispensing Module
- 1) Valve System : JET / Linear / Auger / Spray (depend on production)
2) Air Pressure : 0 ~ 500kPa
3) Dispensing Area : 250 X 250 mm
4) Dispensing Accuracy : ±0.05 mm (option: WMS : Wight Measurement System)
5) Dispensing Speed : 0 ~ 200 mm/sec (depend on product) - Attach Module
- 1Header Picker / Placement Accuracy : ±35um, Angle : ±0.5'
Waffle Tray x 1 (Manual Lo/Unloading) - Conveyor (Single)
- 1) Feeding Type (Speed) : Belt Conveyor System (0 ~ 1000mm/sec)
2) Width : 70 ~ 280mm
3) Width Adjustment : Manual Handling
4) Feeding Height : 900 ±30 mm - Loader / Unloader
- 3Magazine
Magazine Size : 50X150X144 ~ 140X220X160 mm (W X L X H) - XYZ Motion
- 1) Repeatability : ±5um
2) Encoder Resolution : 0.5um
3) Speed(Acceleration) : 1000 mm/sec (up to 1.0G)
4) Travel Area : 350 X 400 X 80 mm
5) Driving Type : Gantry Type Linear Servo - Vision
- 1) Align Algorithm : Geometric Model Finder / Pattern Matching / Corner Finder
2) Bad Product Detector : Bad Unit Finder
3) Illuminator : White LED Light
4) Camera : Top / Bottom CCD 12.0 mm X 10.0 mm (5M Pixel Camera)
5) Inspection Speed : 50 ~ 300msec - Height Sensor
- Laser Sensor, Accuracy : 0.001 mm ±0.2%
- System & Facility
- 1) OS : Windows 10 64bit Professional
2) S/W : DisCraft
3) Supply :
- Air : 5Kgf/cm²
- Electical : 200V ~ 240VAC , 50~60Hz Single Phase 18A
4) Dimension (Weight) : 2055(W) X 1310(L) X 1470(H) (0.75ton)
